Toyota jidosha kabushiki kaisha (20240263336). FILM FORMING METHOD FOR METAL FILM simplified abstract
FILM FORMING METHOD FOR METAL FILM
Organization Name
toyota jidosha kabushiki kaisha
Inventor(s)
Koji Inagaki of Toyota-shi (JP)
Jyunya Murai of Nisshin-shi (JP)
Jun Yoshitomi of Toyota-shi (JP)
Osamu Yamashita of Toyota-shi (JP)
Hiromichi Nakata of Toyota-shi (JP)
Masaaki Nishiyama of Komaki-shi (JP)
FILM FORMING METHOD FOR METAL FILM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240263336 titled 'FILM FORMING METHOD FOR METAL FILM
The patent application describes a method for forming a metal film on a substrate using a plating solution and an electrolyte membrane.
- Metal film is formed on a substrate using a plating solution and an electrolyte membrane.
- The plating solution is circulated outside the container before or during the film forming step.
- The electrolyte membrane is separated from the substrate material by moving the mounting table or container away from each other.
- The plating solution in the container is sealed before the separating step.
- The method ensures efficient and controlled metal film formation on the substrate.
Potential Applications: - Electronics manufacturing - Semiconductor industry - Surface coating for various materials
Problems Solved: - Controlled and precise metal film formation - Efficient use of plating solution - Sealing of the electrolyte membrane for optimal results
Benefits: - Improved quality of metal film - Cost-effective manufacturing process - Enhanced productivity in metal film formation
Commercial Applications: Title: Advanced Metal Film Forming Method for Industrial Applications This technology can be used in industries such as electronics, semiconductors, and automotive for efficient metal film formation processes.
Prior Art: Prior research in metal film formation methods using plating solutions and electrolyte membranes can be found in academic journals and patents related to surface coating technologies.
Frequently Updated Research: Researchers are constantly exploring new methods to improve the efficiency and quality of metal film formation processes using plating solutions and electrolyte membranes.
Questions about Metal Film Forming Method: 1. How does the separation of the electrolyte membrane from the substrate material impact the quality of the metal film?
- The separation process ensures controlled and precise metal film formation on the substrate.
2. What are the potential challenges in implementing this metal film forming method in large-scale industrial applications?
- Large-scale implementation may require optimization of circulation paths and sealing mechanisms to ensure consistent results.
Original Abstract Submitted
a film forming method for a metal film includes steps of, after a substrate material is mounted on a mounting table, forming the metal film on a surface of the substrate material with a plating solution brought into contact with the substrate material through an electrolyte membrane, and with the plating solution sealed, separating the electrolyte membrane from the substrate material by moving at least one of the mounting table and a container in a direction away from the other. the plating solution contained in the container is circulated through a circulation path outside the container, before or during the film forming step. a circulation path is blocked and the plating solution in the container is sealed, before this separating step.