Tokyo electron limited (20250149329). SUBTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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SUBTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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Takashi Matsumoto of Yamanashi JP
SUBTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
This abstract first appeared for US patent application 20250149329 titled 'SUBTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Original Abstract Submitted
a substrate processing method includes: a preparation process of preparing a substrate having an underlying layer; a first process of forming a first graphene film, which has a first stress, on the underlying layer; a second process of forming a second graphene film, which has a second stress different from the first stress, on the first graphene film; and a third process of forming a third graphene film, which has a third stress different from the second stress, on the second graphene film.