Tokyo electron limited (20250144892). BONDING METHOD AND BONDING APPARATUS
BONDING METHOD AND BONDING APPARATUS
Organization Name
Inventor(s)
Hirokazu Ueda of Osaka City JP
Kenji Sekiguchi of Nirasaki City JP
Mitsuaki Iwashita of Nirasaki City JP
BONDING METHOD AND BONDING APPARATUS
This abstract first appeared for US patent application 20250144892 titled 'BONDING METHOD AND BONDING APPARATUS
Original Abstract Submitted
a bonding method includes a first operation of preparing a first substrate having a first surface and a second substrate having a second surface, each of the first surface and the second surface having a first region in which an insulating film is exposed and a second region in which a conductive film is exposed, a second operation of applying an ionic liquid to at least one of the first surface of the first substrate or the second surface of the second substrate, and a third operation of bonding the first surface of the first substrate and the second surface of the second substrate with the ionic liquid.