The boeing company (20250132698). MULTILAYER ELECTROSTATIC PAD
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MULTILAYER ELECTROSTATIC PAD
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Inventor(s)
Nayeem Chowdhury of Melbourne AU
MULTILAYER ELECTROSTATIC PAD
This abstract first appeared for US patent application 20250132698 titled 'MULTILAYER ELECTROSTATIC PAD
Original Abstract Submitted
an electrostatic pad includes a first planar array of first electrodes arranged in a first pattern, and a second planar array of second electrodes arranged in a second pattern that is different from the first pattern, wherein the first and second planar arrays are disposed parallel to each other. a third layer of electrically insulative material may be sandwiched between the first and second planar arrays of respective first and second electrodes.