Texas instruments incorporated (20250102569). 3D TAP & SCAN PORT ARCHITECTURES

3D TAP & SCAN PORT ARCHITECTURES

Organization Name

texas instruments incorporated

Inventor(s)

Lee D. Whetsel of Parker TX US

3D TAP & SCAN PORT ARCHITECTURES

This abstract first appeared for US patent application 20250102569 titled '3D TAP & SCAN PORT ARCHITECTURES

Original Abstract Submitted

this disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. the die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.