Texas instruments incorporated (20250006501). PRE-WAFER FABRICATION LASER DICING
PRE-WAFER FABRICATION LASER DICING
Organization Name
texas instruments incorporated
Inventor(s)
PRE-WAFER FABRICATION LASER DICING
This abstract first appeared for US patent application 20250006501 titled 'PRE-WAFER FABRICATION LASER DICING
Original Abstract Submitted
in examples, a method for manufacturing a semiconductor die comprises, prior to forming circuitry on a semiconductor wafer, forming a horizontal array of cracks in an interior of the wafer using a laser. the method also includes, after forming the horizontal array of cracks, forming circuitry on a device side of the wafer. the method includes forming conductive bumps on the device side of the wafer.