ANTENNA-ON-PACKAGE INTEGRATED CIRCUIT DEVICE

Organization Name

Inventor(s)

ANTENNA-ON-PACKAGE INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240297433 titled 'ANTENNA-ON-PACKAGE INTEGRATED CIRCUIT DEVICE

Simplified Explanation: The patent application describes integrated circuit packages with multiple layers and components for improved performance.

Key Features and Innovation:

First substrate with conductor layers and dielectric layer.
Antennas in the first conductor layer.
Ground plane in the second conductor layer.
Vias connecting antennas to the ground plane.
Second substrate connected to the first substrate with package connectors.
Integrated circuit die between the substrates.
Package connectors on the second substrate.

Potential Applications: This technology can be used in various electronic devices requiring high-performance integrated circuits, such as smartphones, tablets, and IoT devices.

Problems Solved: This technology addresses the need for efficient signal transmission and grounding in integrated circuit packages, improving overall performance and reliability.

Benefits:

Enhanced signal transmission.
Improved grounding.
Increased performance and reliability of integrated circuits.

Commercial Applications: The technology can be applied in the consumer electronics industry for manufacturing advanced electronic devices with improved performance and reliability, potentially leading to a competitive edge in the market.

Prior Art: Readers can explore prior art related to integrated circuit packaging, signal transmission, and grounding techniques in the field of electronic engineering.

Frequently Updated Research: Stay updated on the latest advancements in integrated circuit packaging, signal transmission technologies, and grounding techniques to further enhance the performance of electronic devices.

Questions about Integrated Circuit Packages: 1. What are the key components of an integrated circuit package? 2. How does the placement of antennas and ground planes affect signal transmission in integrated circuits?

Original Abstract Submitted

integrated circuit packages are provided. in an example integrated circuit package, a first substrate includes a set of conductor layers including first and second conductor layers, and at least one dielectric layer disposed between the first and second conductor layers; antennas disposed in the first conductor layer. a ground plane is disposed in the second conductor layer, and a set of vias is coupled between the antennas and the ground plane. a second substrate having a first side is coupled to the first substrate via a first set of package connectors. an integrated circuit die is disposed between the first and second substrates and has a side that is coupled to the set of conductor layers. a second set of package connectors coupled to a second side of the second substrate.