Texas instruments incorporated (20240258212). SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE simplified abstract
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
Organization Name
texas instruments incorporated
Inventor(s)
Rajen Murugan of DALLAS TX (US)
Sylvester Ankamah-kusi of DALLAS TX (US)
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258212 titled 'SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
The abstract of the patent application describes a packaged semiconductor device that includes a lead frame, a semiconductor die, bond wires, bump bonds, a passive circuit element, a substrate, and a molding material.
- The semiconductor die is mounted to the lead frame, with a first set of bond wires and/or bump bonds electrically coupling the die to the lead frame.
- A passive circuit element is on a substrate, which is mounted to the second side of the die.
- A second set of bond wires and/or bump bonds electrically couple the passive circuit element to the die.
- A molding material encapsulates the passive circuit element, the die, and at least a portion of the lead frame.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial control systems, and medical devices.
Problems Solved: - Provides a compact and efficient way to integrate passive circuit elements with semiconductor dies. - Ensures reliable electrical connections between the die, passive circuit element, and lead frame.
Benefits: - Improved performance and reliability of semiconductor devices. - Cost-effective manufacturing process for packaged semiconductor devices.
Commercial Applications: - This technology has potential commercial applications in the consumer electronics industry, automotive sector, and medical device manufacturing.
Questions about the Technology: 1. How does this technology improve the integration of passive circuit elements in semiconductor devices? 2. What are the key advantages of encapsulating the passive circuit element, die, and lead frame in a molding material?
Original Abstract Submitted
a packaged semiconductor device includes a lead frame and a semiconductor die. the semiconductor die has first and second opposing sides, and the first side of the die is mounted to the lead frame. a first set of bond wires and/or bump bonds are configured to electrically couple the die to the lead frame. a passive circuit element is on a substrate, and the substrate is mounted to the second side of the die. a second set of bond wires and/or bump bonds are configured to electrically couple the passive circuit element to the die. a molding material is configured to encapsulate the passive circuit element, the die, and at least a portion of the lead frame.