Tesla, Inc. patent applications on March 27th, 2025
Patent Applications by Tesla, Inc. on March 27th, 2025
Tesla, Inc.: 1 patent applications
Tesla, Inc. has applied for patents in the areas of H01L23/367 (1), H01L23/00 (1), H01L23/373 (1) H01L23/367 (1)
With keywords such as: circuit, reflow, integrated, temperature, solder, heat, spreader, include, material, and interface in patent application abstracts.
Patent Applications by Tesla, Inc.
Inventor(s): Mohamed Haitham Helmy Nasr of Sunnyvale CA US for tesla, inc., Srikumar Seshasayee Iyengar of San Jose CA US for tesla, inc., Aydin Nabovati of Toronto CA for tesla, inc., Surinderpal Singh Jassal of Dublin CA US for tesla, inc., Aleksandar Plavsic of Mequon WI US for tesla, inc.
IPC Code(s): H01L23/367, H01L23/00, H01L23/373
CPC Code(s): H01L23/367
Abstract: a method can include attaching an integrated circuit to a printed circuit board in a first solder reflow process at a first reflow temperature. a method can include soldering a heat spreader to the integrated circuit in a second solder reflow process at a second reflow temperature, wherein the second reflow temperature is lower than the first reflow temperature. a method can include attaching a cold plate to the heat spreader such that a thermal interface material is positioned between the heat spreader and the cold plate. related integrated circuit assemblies are disclosed with thermal interface material, such as solder or a liquid metal, positioned between a heat spreader and an integrated circuit. the thermal interface material has a lower melting temperature than solder on another surface of the integrated circuit.