Taiwan semiconductor manufacturing company, ltd. (20250149437). INTERCONNECTION STRUCTURE
INTERCONNECTION STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
INTERCONNECTION STRUCTURE
This abstract first appeared for US patent application 20250149437 titled 'INTERCONNECTION STRUCTURE
Original Abstract Submitted
an interconnection structure includes a semiconductor substrate that is formed with a first metal trench and a second metal trench, a first metal via, a second metal via, a third metal trench and a fourth metal trench. the first metal via is disposed over and connected to the first metal trench. the second metal via is disposed over and connected to the second metal trench. the third metal trench is disposed over and connected to the first metal via. the fourth metal trench that is disposed over and connected to the second metal via. a thickness of the third metal trench is different from a thickness of the fourth metal trench.