Taiwan semiconductor manufacturing company, ltd. (20250142832). METHOD OF FORMING SEMICONDUCTOR STRUCTURE
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Sheng-Chen Wang of Hsinchu City TW
Han-Jong Chia of Hsinchu City TW
Feng-Cheng Yang of Hsinchu County TW
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
This abstract first appeared for US patent application 20250142832 titled 'METHOD OF FORMING SEMICONDUCTOR STRUCTURE
Original Abstract Submitted
a semiconductor structure and method of forming the same are provided. the semiconductor structure includes a circuit structure, an interlayer structure and a memory structure. the circuit structure includes a substrate having semiconductor devices formed thereon; a dielectric structure disposed over the semiconductor devices; and an interconnect layer embedded in the dielectric structure and connected to the semiconductor devices. the interlayer structure is disposed over the circuit structure. the memory structure is disposed over the interlayer structure and physically separated from the circuit structure by the interlayer structure.