Taiwan semiconductor manufacturing company, ltd. (20250140743). CHIP STACKING STRUCTURE
CHIP STACKING STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chao-Wen Shih of Hsinchu County TW
Kuo-Chiang Ting of Hsinchu City TW
Yen-Ming Chen of Hsin-Chu County TW
CHIP STACKING STRUCTURE
This abstract first appeared for US patent application 20250140743 titled 'CHIP STACKING STRUCTURE
Original Abstract Submitted
a structure including a first semiconductor die, second semiconductor dies, a bridge die, and a gap filling material is provided. the first semiconductor die includes integrated circuit regions. the second semiconductor dies are disposed over and electrically connected to the first semiconductor die. the bridge die is disposed over and electrically connected to the first semiconductor die, and the integrated circuit regions are electrically connected to each other through the bridge die. the gap filling material is disposed on the first semiconductor die to laterally encapsulate the bridge die and the second semiconductor dies.