SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 20250140721 titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

a semiconductor structure and a manufacturing method thereof are provided. the semiconductor structure includes an integrated circuit (ic) component, an insulating layer laterally encapsulating the ic component, a redistribution structure disposed on the insulating layer and the ic component, and a warpage control portion coupling to a back side of the ic component opposite to the redistribution structure. the redistribution structure is electrically connected to the ic component. the warpage control portion includes a substrate, a patterned dielectric layer disposed between the substrate and the ic component, and a metal pattern embedded in the patterned dielectric layer and electrically isolated from the ic component.