Taiwan semiconductor manufacturing company, ltd. (20250140667). SEMICONDUCTOR PACKAGE AND METHOD
SEMICONDUCTOR PACKAGE AND METHOD
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chih-Chiang Chang of New Taipei City TW
Hua-Wei Tseng of New Taipei City TW
SEMICONDUCTOR PACKAGE AND METHOD
This abstract first appeared for US patent application 20250140667 titled 'SEMICONDUCTOR PACKAGE AND METHOD
Original Abstract Submitted
in a semiconductor package having a redistribution structure, two or more semiconductor dies are connected to a first side of the redistribution structure and an encapsulant surrounds the two or more semiconductor dies. an integrated passive device (ipd) is connected on a second side of the redistribution structure. the second side is opposite to the first side and the ipd is electrically coupled to the redistribution structure. an interconnect device is connected on the second side of the redistribution structure and is electrically coupled to the redistribution structure. two or more external connections are on the second side of the redistribution structure and are electrically coupled to the redistribution structure.