Taiwan semiconductor manufacturing company, ltd. (20250132296). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsien-Wei Chen of Hsinchu City TW
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 20250132296 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
a semiconductor package includes an interposer including a first redistribution structure, a first semiconductor die electrically coupled to the first redistribution structure through conductive joints, and a first encapsulant disposed on the first redistribution structure and laterally covering the first semiconductor die. the first semiconductor die includes a semiconductor substrate including a first side facing the first redistribution structure and a second side opposite to the first side, a through substrate via provided within the semiconductor substrate, and a passive device disposed between the second side of the semiconductor substrate and the conductive joints.