PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu City TW

Jie Chen of New Taipei City TW

Ming-Fa Chen of Taichung City TW

PACKAGE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 20250132294 titled 'PACKAGE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

a package includes a first die and a second die. the first die includes a first capacitor. the second die includes a second capacitor. the second die is stacked on the first die and is located within a span of the first die. the first capacitor is electrically connected to the second capacitor.