Taiwan semiconductor manufacturing company, ltd. (20250062209). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wen-Sheng Chen of Hsinchu (TW)
Wei-Ling Chang of Hsinchu (TW)
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
This abstract first appeared for US patent application 20250062209 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
Original Abstract Submitted
a semiconductor device and a semiconductor package structure are provided. the semiconductor device includes a radio frequency (rf) circuit, at least one ultra thick metal (utm) layer and at least one aluminum (ap) mesh layer. the utm layer is stacked on the rf circuit. the aluminum mesh layer is stacked on the utm layer, and the utm layer is connected to a power source or a ground through the aluminum mesh layer.