Taiwan semiconductor manufacturing company, ltd. (20250062184). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chi-Yang Yu of Taoyuan City (TW)
Chin-Liang Chen of Kaohsiung City (TW)
Kuan-Lin Ho of Hsinchu City (TW)
Yu-Min Liang of Taoyuan City (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 20250062184 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
a semiconductor package and a manufacturing method thereof are provided. the semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. the first and second semiconductor dies are different types of dies and are disposed side by side. the molding compound encloses the first and second semiconductor dies. the heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. the adhesive material is filled and contacted between the heat dissipation module and the molding compound. the semiconductor package has a central region and a peripheral region surrounding the central region. the first and second semiconductor dies are located within the central region. a sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.