Taiwan semiconductor manufacturing company, ltd. (20250062136). Packages with Implantation
Packages with Implantation
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Ming-Tsu Chung of Hsinchu (TW)
Yung-Chi Lin of Su-Lin City (TW)
Yang-Chih Hsueh of Hsinchu (TW)
Packages with Implantation
This abstract first appeared for US patent application 20250062136 titled 'Packages with Implantation
Original Abstract Submitted
a method includes bonding a device die onto a package component. the device die includes a semiconductor substrate, and a through-via extending into the semiconductor substrate. the method further includes depositing a dielectric liner lining sidewalls of the device die, depositing a dielectric layer on the dielectric liner, and planarizing the dielectric layer and the device die. remaining portions of the dielectric liner and the dielectric layer form a gap-filling region, and a top end of the through-via is revealed. an implantation process is performed to introduce a stress modulation dopant into at least one of the dielectric liner and the dielectric layer. a redistribution line is formed over and electrically connecting to the through-via.