Taiwan semiconductor manufacturing company, ltd. (20250006687). HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Zheng-Yong Liang of Kaohsiung City TW
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
This abstract first appeared for US patent application 20250006687 titled 'HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
Original Abstract Submitted
an integrated circuit die with two material layers having metal nano-particles and the method of forming the same are provided. the integrated circuit die includes a device layer comprising a first transistor, a first interconnect structure on a first side of the device layer, a first material layer on the first interconnect structure, wherein the first material layer comprises first metal nano-particles, and a second material layer bonded to the first material layer, wherein the second material layer comprises second metal nano-particles, and wherein the first material layer and the second material layer share an interface.