SEMICONDUCTOR STRUCTURES WITH COVER LAYERS

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Cheng-Hsiang Wu of New Taipei City TW

Tsung-Yang Hsieh of Taipei City TW

Chien-Chang Lee of Hsinchu City TW

Wen-Tung Chuang of Hsinchu County TW

SEMICONDUCTOR STRUCTURES WITH COVER LAYERS

This abstract first appeared for US patent application 20250006564 titled 'SEMICONDUCTOR STRUCTURES WITH COVER LAYERS

Original Abstract Submitted

semiconductor structures, die stack structures, and fabrication methods are provided. in one example, a semiconductor structure includes a die having a test pad disposed on a front side of the die. the test pad has a probe mark in an upper portion of the test pad. the probe mark has an open end at a top surface of the test pad, a bottom wall, a sidewall connected to the bottom wall, and a space between the open end, the bottom wall and the sidewall. the semiconductor structure further includes a first cover layer and a second cover layer. the first cover layer is disposed on the front side of the first test pad and the sidewall and the bottom wall of the probe mark. the second cover layer is disposed on the first cover layer. the first and second cover layers comprise different materials.