Taiwan semiconductor manufacturing company, ltd. (20240413121). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
CHIH-TING Lai of Hsinchu City (TW)
Kris Lipu Chuang of Hsinchu City (TW)
Hsin Ting Lin of Hsinchu County (TW)
Tsung-Yu Chen of Hsinchu City (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 20240413121 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
a semiconductor device includes a supporting structure, a die stack, and a redistribution circuit structure. the die stack is disposed over the supporting structure and includes a first semiconductor die comprising a substrate and a second semiconductor die, where the first semiconductor die is between the second semiconductor die and the supporting structure, and a material of the supporting structure is different from a material of the substrate of the first semiconductor die. the redistribution circuit structure is disposed over the die stack and electrically coupled to the first semiconductor die and the second semiconductor die.