Taiwan semiconductor manufacturing company, ltd. (20240345425). SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240345425 titled 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD
The method described in the abstract involves the formation of an optical component and three thermal control mechanisms over a substrate. The optical component consists of main paths and side paths, with thermoelectric members and conductive structures in each thermal control mechanism.
- The optical component has main paths and side paths with thermoelectric members for thermal control.
- Three thermal control mechanisms are used, each with a thermoelectric member and a conductive structure.
- The first and second side paths are between the first and third thermal control mechanisms, and the second side path is between the second and third thermal control mechanisms.
Potential Applications: - Optical systems requiring precise temperature control - High-performance electronic devices - Aerospace and defense technologies
Problems Solved: - Maintaining stable temperatures in optical components - Preventing overheating in sensitive electronic equipment
Benefits: - Improved performance and longevity of optical components - Enhanced reliability of electronic devices in extreme conditions
Commercial Applications: Title: Advanced Thermal Control System for Optical Components This technology can be utilized in industries such as telecommunications, medical imaging, and scientific research where precise temperature control is crucial for optimal performance.
Questions about the technology: 1. How does the thermal control system improve the efficiency of optical components? 2. What are the potential cost savings associated with implementing this technology in electronic devices?
Frequently Updated Research: Researchers are continuously exploring new materials and designs for thermoelectric devices to enhance their efficiency and effectiveness in various applications.
Original Abstract Submitted
a method includes forming, over a substrate, an optical component and first, second and third thermal control mechanisms. the optical component includes first and second main paths, and first and second side paths each having opposite ends correspondingly coupled to the first and second main paths. the second side path is spaced from the first side path. each of the first, second and third thermal control mechanisms includes a first thermoelectric member having a first conductivity type, a second thermoelectric member having a second conductivity type opposite to the first conductivity type, and a conductive structure that electrically connects the first thermoelectric member to the second thermoelectric member. the first side path is between the first and third thermal control mechanisms. the second side path is between the second and third thermal control mechanisms. the third thermal control mechanism is between the first and second side paths.