Package-On-Package Device

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Package-On-Package Device - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240266297 titled 'Package-On-Package Device

The abstract of the patent application describes a package with a complex structure that includes multiple components such as dies, metal-to-metal bonding, dielectric materials, vias, and molding materials.

The package consists of a redistribution structure with a die package on one side, containing a first die connected to a second die through metal-to-metal and dielectric-to-dielectric bonding.
A dielectric material covers the first and second dies, surrounding the first die, and a first through via extends through the dielectric material to connect to the first die and a first via of the redistribution structure.
A semiconductor device on the same side of the redistribution structure includes a conductive connector, with a second via of the redistribution structure making contact with the connector.
A first molding material surrounds the die package and the semiconductor device, and a package through via extends through the molding material to contact a third via of the redistribution structure.

Potential Applications: - This technology can be used in advanced semiconductor packaging for high-performance electronic devices. - It can also find applications in the manufacturing of microprocessors, memory chips, and other integrated circuits.

Problems Solved: - Provides a reliable and efficient method for connecting multiple dies in a package. - Enhances the overall performance and reliability of semiconductor devices.

Benefits: - Improved connectivity and signal transmission between dies. - Enhanced durability and longevity of the package. - Enables the development of more compact and powerful electronic devices.

Commercial Applications: - This technology can be utilized in the production of smartphones, tablets, laptops, and other consumer electronics. - It can also be beneficial in the automotive industry for advanced driver-assistance systems and in the aerospace sector for avionics applications.

Questions about the technology: 1. How does the metal-to-metal bonding contribute to the overall reliability of the package? 2. What are the specific advantages of using dielectric materials in this packaging structure?

Original Abstract Submitted

a package includes a redistribution structure, a die package on a first side of the redistribution structure including a first die connected to a second die by metal-to-metal bonding and dielectric-to-dielectric bonding, a dielectric material over the first die and the second die and surrounding the first die, and a first through via extending through the dielectric material and connected to the first die and a first via of the redistribution structure, a semiconductor device on the first side of the redistribution structure includes a conductive connector, wherein a second via of the redistribution structure contacts the conductive connector of the semiconductor device, a first molding material on the redistribution structure and surrounding the die package and the semiconductor device, and a package through via extending through the first molding material to contact a third via of the redistribution structure.