PHOTONICS INTEGRATED CIRCUIT PACKAGE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

PHOTONICS INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240266296 titled 'PHOTONICS INTEGRATED CIRCUIT PACKAGE

The integrated circuit package described in the patent application integrates a photonic die (ODIE) and an electronic die (EDIE) within a package that includes multiple redistribution layers and molded material surrounding the dies.

The integrated circuit package combines photonic and electronic components in a single package.
The package includes redistribution layers that facilitate communication between the photonic and electronic dies.
Molded material partially surrounds the dies to provide protection and structural support.
This innovation enables the creation of compact and efficient integrated circuits with both photonic and electronic functionalities.
The integration of photonic and electronic components in a single package can lead to improved performance and reduced footprint in various applications.

Potential Applications: - Data centers - Telecommunications - High-speed computing

Problems Solved: - Integration of photonic and electronic components - Space constraints in electronic devices - Communication between different types of dies in an integrated circuit

Benefits: - Enhanced performance - Reduced footprint - Simplified manufacturing process

Commercial Applications: Title: "Next-Generation Integrated Circuit Packages for Enhanced Performance" This technology can be used in data centers, telecommunications equipment, and high-speed computing devices to improve efficiency and performance.

Questions about the technology: 1. How does the integration of photonic and electronic components benefit the performance of integrated circuits? 2. What are the potential challenges in manufacturing integrated circuit packages with both photonic and electronic dies?

Original Abstract Submitted

an integrated circuit package integrates a photonic die (odie) and an electronic die (edie). more specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the odie and/or the edie, where molded material at least partially surrounds the at least one of the odie and/or the edie.