Taiwan semiconductor manufacturing company, ltd. (20240262096). LAMINATION APPARATUS AND METHOD simplified abstract
LAMINATION APPARATUS AND METHOD
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Yu-Ting Chiu of Hsinchu County (TW)
Ying-Jui Huang of Hsinchu County (TW)
Chien-Ling Hwang of Hsinchu City (TW)
Ching-Hua Hsieh of Hsinchu (TW)
LAMINATION APPARATUS AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240262096 titled 'LAMINATION APPARATUS AND METHOD
Simplified Explanation: The patent application describes a method and apparatus for laminating a film to a wafer in a process chamber.
- Achieving a vacuum state and process temperature in the chamber
- Laminating the film to the wafer's surface
Key Features and Innovation:
- Method for laminating film to wafer in a controlled environment
- Use of vacuum state and process temperature for lamination process
Potential Applications:
- Semiconductor manufacturing
- Microelectronics production
Problems Solved:
- Ensuring precise lamination of film to wafer
- Controlling environmental factors during lamination process
Benefits:
- Improved quality and reliability of wafer-film lamination
- Enhanced performance of semiconductor devices
Commercial Applications: The technology can be used in the semiconductor industry for manufacturing high-quality electronic components.
Questions about Lamination Process: 1. How does the vacuum state contribute to the lamination process? 2. What are the advantages of using controlled process temperature during lamination?
Frequently Updated Research: Ongoing research focuses on optimizing the lamination process for increased efficiency and quality in semiconductor manufacturing.
Original Abstract Submitted
a method for laminating a film to a wafer and apparatus for performing the lamination process are disclosed. the method includes providing the wafer and the film in a process chamber where the wafer and the film are separated from each other, achieving a vacuum state and a process temperature in the process chamber, and laminating the film to contact a surface of the wafer.