Taiwan semiconductor manufacturing company, ltd. (20240258286). INTEGRATED CIRCUIT PACKAGE AND METHOD
INTEGRATED CIRCUIT PACKAGE AND METHOD
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chuei-Tang Wang of Taichung City TW
Chieh-Yen Chen of Taipei City TW
INTEGRATED CIRCUIT PACKAGE AND METHOD
This abstract first appeared for US patent application 20240258286 titled 'INTEGRATED CIRCUIT PACKAGE AND METHOD
Original Abstract Submitted
in an embodiment, a structure includes: a processor device including logic devices; a first memory device directly face-to-face bonded to the processor device by metal-to-metal bonds and by dielectric-to-dielectric bonds; a first dielectric layer laterally surrounding the first memory device; a redistribution structure over the first dielectric layer and the first memory device, the redistribution structure including metallization patterns; and first conductive vias extending through the first dielectric layer, the first conductive vias connecting the metallization patterns of the redistribution structure to the processor device.