Taiwan semiconductor manufacturing company, ltd. (20240258259). SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hui-Min Huang of Taoyuan City TW
Ming-Da Cheng of Taoyuan City TW
Wei-Hung Lin of Xinfeng Township TW
Kai-Jun Zhan of Taoyuan City TW
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
This abstract first appeared for US patent application 20240258259 titled 'SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
Original Abstract Submitted
a semiconductor device structure is provided. the semiconductor device structure includes a semiconductor substrate and a first conductive structure over the semiconductor substrate. the first conductive structure has a first protruding portion extending towards the semiconductor substrate from a lower surface of the first conductive structure. the semiconductor device structure also includes a second conductive structure over the semiconductor substrate. the second conductive structure is substantially as wide as the first conductive structure, and the second conductive structure has a second protruding portion extending towards the semiconductor substrate from a lower surface of the second conductive structure. the first conductive structure is closer to a center point of the semiconductor substrate than the second conductive structure. the second protruding portion is wider than the first protruding portion, and bottoms of the first protruding portion and the second protruding portion are substantially level with each other.