Taiwan semiconductor manufacturing company, ltd. (20240258237). SEMICONDUCTOR DEVICES
SEMICONDUCTOR DEVICES
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
SEMICONDUCTOR DEVICES
This abstract first appeared for US patent application 20240258237 titled 'SEMICONDUCTOR DEVICES
Original Abstract Submitted
in an embodiment, a device includes: a first fin; a gate structure over the first fin; a first source/drain region adjacent the gate structure; an etch stop layer over the first source/drain region; a conductive line over the etch stop layer, the conductive line isolated from the first source/drain region by the etch stop layer, a top surface of the conductive line being coplanar with a top surface of the gate structure; and a power rail contact extending through the first fin, the power rail contact connected to the first source/drain region.