Taiwan semiconductor manufacturing company, ltd. (20240258162). INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER
INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Che-Cheng Chang of New Taipei City TW
Chih-Han Lin of Hsinchu City TW
INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER
This abstract first appeared for US patent application 20240258162 titled 'INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER
Original Abstract Submitted
a device comprises a non-insulator structure, a dielectric layer, a metal via, a metal line, and a dielectric structure. the dielectric layer is over the non-insulator structure. the metal via is in a lower portion of the dielectric layer. the metal line is in an upper portion of the dielectric layer. the dielectric structure is embedded in a recessed region in the lower portion of the dielectric layer. the dielectric structure has a tapered top portion interfacing the metal via.