Taiwan semiconductor manufacturing company, ltd. (20240215261). SEMICONDUCTOR PACKAGES simplified abstract
SEMICONDUCTOR PACKAGES
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsiang-Ku Shen of Hsinchu City (TW)
Ku-Feng Lin of New Taipei City (TW)
Liang-Wei Wang of Hsinchu City (TW)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240215261 titled 'SEMICONDUCTOR PACKAGES
The semiconductor package described in the patent application consists of a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first semiconductor substrate, a first bonding structure bonded to the second integrated circuit, a ferromagnetic layer surrounding the first bonding structure, and a memory cell between the first semiconductor substrate and the first bonding structure.
- The semiconductor package features a unique design with a ferromagnetic layer surrounding the bonding structure, enhancing the overall performance and reliability of the integrated circuits.
- The inclusion of a memory cell between the semiconductor substrate and the bonding structure allows for efficient data storage and retrieval within the package.
- The bonding structure between the first and second integrated circuits ensures secure connections and proper functioning of the semiconductor package.
- The innovative design of the semiconductor package offers potential improvements in data processing speed, memory capacity, and overall system efficiency.
- By combining different integrated circuits within a single package, the technology enables compact and versatile electronic devices.
Potential Applications: - This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and IoT devices. - It can also be used in automotive electronics, medical devices, and industrial automation systems.
Problems Solved: - Enhances the performance and reliability of integrated circuits. - Improves data processing speed and memory capacity. - Enables compact and versatile electronic devices.
Benefits: - Increased efficiency and reliability of electronic devices. - Enhanced data storage and processing capabilities. - Compact design for space-saving applications.
Commercial Applications: Title: Innovative Semiconductor Package Technology for Enhanced Electronic Devices This technology can be utilized in the development of high-performance electronic devices, catering to a wide range of industries including consumer electronics, automotive, healthcare, and industrial automation.
Questions about Semiconductor Package Technology: 1. How does the ferromagnetic layer surrounding the bonding structure contribute to the performance of the semiconductor package? 2. What are the potential implications of integrating multiple integrated circuits within a single package for electronic device manufacturers?
Original Abstract Submitted
a semiconductor package includes a first integrated circuit and a second integrated circuit. the first integrated circuit includes a first semiconductor substrate, a first bonding structure bonded to the second integrated circuit, a ferromagnetic layer surrounding the first bonding structure, and a memory cell between the first semiconductor substrate and the first bonding structure.