Taiwan semiconductor manufacturing co., ltd. (20250126723). METHOD FOR FORMING CIRCUIT BOARD
METHOD FOR FORMING CIRCUIT BOARD
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chien-Hsun Lee of Hsin-chu County TW
Chen-Hua Yu of Hsinchu City TW
Chung-Shi Liu of Hsinchu City TW
METHOD FOR FORMING CIRCUIT BOARD
This abstract first appeared for US patent application 20250126723 titled 'METHOD FOR FORMING CIRCUIT BOARD
Original Abstract Submitted
circuit board includes conductive plate, core dielectric layer, metallization layer, first build-up stack, second build-up stack. conductive plate has channels extending from top surface to bottom surface. core dielectric layer extends on covering top surface and side surfaces of conductive plate. metallization layer extends on core dielectric layer and within channels of conductive plate. core dielectric layer insulates metallization layer from conductive plate. first build-up stack is disposed on top surface of conductive plate and includes conductive layers alternately stacked with dielectric layers. conductive layers electrically connect to metallization layer. second build-up stack is disposed on bottom surface of conductive plate. second build-up stack includes bottommost dielectric layer and bottommost conductive layer. bottommost dielectric layer covers bottom surface of conductive plate. bottommost conductive layer is disposed on bottommost dielectric layer and electrically connects to metallization layer. first build-up stack includes more conductive and dielectric layers than second build-up stack.