Taiwan semiconductor manufacturing co., ltd. (20250120122). BACKSIDE DIELECTRIC PLUG
BACKSIDE DIELECTRIC PLUG
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chen-Ming Lee of Taoyuan County TW
Fu-Kai Yang of Hsinchu City TW
BACKSIDE DIELECTRIC PLUG
This abstract first appeared for US patent application 20250120122 titled 'BACKSIDE DIELECTRIC PLUG
Original Abstract Submitted
one aspect of the present disclosure pertains to a semiconductor device. the semiconductor device includes a semiconductor substrate and a transistor formed over the semiconductor substrate. the transistor includes a first source/drain (s/d) feature, a second s/d feature, a channel region interposed between the first and second s/d features, and a gate stack engaging the channel region. the semiconductor device includes a first s/d contact landing on a top surface of the first s/d feature, a second s/d contact landing on a top surface of the second s/d feature, and a dielectric plug penetrating through the semiconductor substrate and landing on a bottom surface of the first s/d feature. the dielectric plug spans a width equal to or smaller than a width of the first s/d feature.
- Taiwan semiconductor manufacturing co., ltd.
- Chen-Ming Lee of Taoyuan County TW
- Shih-Chieh Wu of Hsinchu TW
- Po-Yu Huang of Hsinchu TW
- I-Wen Wu of Hsinchu City TW
- Fu-Kai Yang of Hsinchu City TW
- Mei-Yun Wang of Hsin-Chu TW
- H01L29/417
- H01L21/8238
- H01L27/092
- H01L29/06
- H01L29/423
- H01L29/66
- H01L29/775
- H01L29/786
- CPC H10D30/6729