Taiwan semiconductor manufacturing co., ltd. (20250118707). INTEGRATED CIRCUIT PACKAGES AND METHODS
INTEGRATED CIRCUIT PACKAGES AND METHODS
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chao-Wen Shih of Zhubei City TW
Min-Chien Hsiao of Taichung City TW
Yen-Ming Chen of Chu-Pei City TW
INTEGRATED CIRCUIT PACKAGES AND METHODS
This abstract first appeared for US patent application 20250118707 titled 'INTEGRATED CIRCUIT PACKAGES AND METHODS
Original Abstract Submitted
an integrated circuit package and the method of forming the same are provided. the integrated circuit package may include a first die, a first gap-fill layer along sidewalls of the first die, a first bonding layer on the first die and the first gap-fill layer, and a first die connector in the first bonding layer. the first die connector may be directly over an interface between the first die and the first gap-fill layer.