Taiwan semiconductor manufacturing co., ltd. (20250105080). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Shuo-Mao Chen of New Taipei City TW
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250105080 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package and a manufacturing method thereof are provided. the semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. the circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. the circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. a location of the metal floor plate corresponds to a location of the cavity. the metal floor plate is electrically floating and isolated by the dielectric material. the semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. the filling material is disposed between the semiconductor die and the circuit substrate. the filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.