Taiwan semiconductor manufacturing co., ltd. (20250098296). INTEGRATED CIRCUIT WITH LATCH-UP IMMUNITY
INTEGRATED CIRCUIT WITH LATCH-UP IMMUNITY
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chih-Chuan Yang of Tainan City TW
INTEGRATED CIRCUIT WITH LATCH-UP IMMUNITY
This abstract first appeared for US patent application 20250098296 titled 'INTEGRATED CIRCUIT WITH LATCH-UP IMMUNITY
Original Abstract Submitted
various embodiments of the present disclosure are directed towards a method for forming an integrated chip. the method includes forming an epitaxial structure having a first doping type over a first portion of a semiconductor substrate. a second portion of the semiconductor substrate is formed over the epitaxial structure and the first portion of the semiconductor substrate. a first doped region having the first doping type is formed in the second portion of the semiconductor substrate and directly over the epitaxial structure. a second doped region having a second doping type opposite the first doping type is formed in the second portion of the semiconductor substrate, where the second doped region is formed on a side of the epitaxial structure. a plurality of fins of the semiconductor substrate are formed by selectively removing portions of the second portion of the semiconductor substrate.