Taiwan semiconductor manufacturing co., ltd. (20250098270). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Hsin-Che Chiang of Taipei City TW
Ju-Yuan Tzeng of New Taipei City TW
Chun-Sheng Liang of Changhua County TW
Chih-Yang Yeh of Hsinchu County TW
Shu-Hui Wang of Hsinchu City TW
Jeng-Ya David Yeh of New Taipei City TW
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 20250098270 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
a method includes forming a semiconductor fin over a substrate; forming a gate structure over the semiconductor fin, the gate structure comprising: a first metallic layer; a second metallic layer over the first metallic layer, wherein the first metallic layer is a metal compound of a first element and a second element and the second metallic layer is a single-element metal of the second element; and an oxide layer between the first metallic layer and the second metallic layer.
- Taiwan semiconductor manufacturing co., ltd.
- Hsin-Che Chiang of Taipei City TW
- Ju-Yuan Tzeng of New Taipei City TW
- Chun-Sheng Liang of Changhua County TW
- Chih-Yang Yeh of Hsinchu County TW
- Shu-Hui Wang of Hsinchu City TW
- Jeng-Ya David Yeh of New Taipei City TW
- H01L29/423
- H01L21/28
- H01L21/768
- H01L23/528
- H01L23/532
- H01L29/165
- H01L29/49
- H01L29/51
- H01L29/66
- H01L29/78
- CPC H10D64/517