SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Ming-Hung Tseng of Miaoli County (TW)

Tzu-Sung Huang of Tainan City (TW)

Tsung-Hsien Chiang of Hsinchu (TW)

An-Jhih Su of Taoyuan City (TW)

Yu-Jin Hu of Taoyuan City (TW)

Hua-Wei Tseng of New Taipei City (TW)

Cheng-Hsien Hsieh of Kaohsiung City (TW)

Wei-Cheng Wu of Hsinchu City (TW)

Der-Chyang Yeh of Hsin-Chu (TW)

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 20240429142 titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

a semiconductor device includes first ic dies disposed side-by-side, a second ic die overlapping and electrically coupled to the first ic dies, and first conductive features. each first ic die includes first and second die connectors. a first pitch of the first die connectors is less than a second pitch of the second die connectors and is substantially equal to a third pitch of the third die connectors of the second ic die. the first conductive features are interposed between and electrically coupled to the first and third die connectors. each first conductive feature includes at least a first conductive bump and at least a first conductive joint.