Taiwan semiconductor manufacturing co., ltd. (20240420978). RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chi-hsiang Shen of Tainan (TW)
Te-Chien Hou of Kaohsiung (TW)
Tang-Kuei Chang of Tainan (TW)
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
This abstract first appeared for US patent application 20240420978 titled 'RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
Original Abstract Submitted
provided is a chemical-mechanical polishing apparatus, a retaining ring for a chemical-mechanical polishing apparatus, and a chemical-mechanical polishing method. a chemical-mechanical polishing apparatus includes a polishing pad; a polishing head configured to receive a wafer and to hold the wafer against the polishing pad; and a retaining ring configured to engage with the polishing head, wherein the retaining ring is formed with channels configured for flowing a slurry in a flow direction from outside the retaining ring to inside the retaining ring, wherein the channels have a cross-sectional flow area that decreases in the flow direction.