TOPPAN Holdings Inc. Patent Application Trends in 2024
TOPPAN Holdings Inc. Patent Filing Activity
TOPPAN Holdings Inc. patent applications in 2024
Top 10 Technology Areas
- B32B27/08 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- B32B27/32 (comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers)
- G01S17/894 (3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar)
- Count: 3 patents
- Example: 20240210535. RANGE IMAGING DEVICE AND RANGE IMAGING METHOD simplified abstract (TOPPAN HOLDINGS INC.)
- B32B7/12 (using interposed adhesives or interposed materials with bonding properties)
- B32B27/10 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- B32B2255/10 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- B32B2255/20 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- B32B2307/31 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- B32B2307/7242 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- B32B2307/748 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
Emerging Technology Areas
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- H05K2201/09827 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240224426. WIRING SUBSTRATE simplified abstract (TOPPAN HOLDINGS INC.)
- H05K2201/0959 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240224426. WIRING SUBSTRATE simplified abstract (TOPPAN HOLDINGS INC.)
- H05K2201/09536 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240224426. WIRING SUBSTRATE simplified abstract (TOPPAN HOLDINGS INC.)
- H05K2201/068 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240224426. WIRING SUBSTRATE simplified abstract (TOPPAN HOLDINGS INC.)
- H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240224426. WIRING SUBSTRATE simplified abstract (TOPPAN HOLDINGS INC.)
- H05K1/0306 (Use of materials for the substrate)
- Count: 1 patents
- Example: 20240224426. WIRING SUBSTRATE simplified abstract (TOPPAN HOLDINGS INC.)
- H05K1/162 (incorporating printed electric components, e.g. printed resistor, capacitor, inductor)
- Count: 1 patents
- Example: 20240224426. WIRING SUBSTRATE simplified abstract (TOPPAN HOLDINGS INC.)
- H05K3/4626 (Manufacturing multilayer circuits)
- H01L23/32 (Holders for supporting the complete device in operation, i.e. detachable fixtures ()
- H01L23/142 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Top Inventors
- Kunihiro HATAKEYAMA (3 patents)
- Ryoma TANABE (2 patents)
- Hiromitsu HARIU (2 patents)
- Masanobu YOSHINAGA (1 patent)
- Ryo WARIGAYA (1 patent)
- Masahito TANABE (1 patent)
- Taketo NUMAZAWA (1 patent)
- Junya IMAMOTO (1 patent)
- Shunichi Shiokawa (1 patent)
- Yuki Ejima (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Pages with broken file links
- TOPPAN Holdings Inc.
- Companies
- CPC C09J7/00
- CPC B32B7/12
- CPC B32B15/082
- CPC B32B15/085
- CPC B32B15/09
- CPC B32B15/20
- CPC B32B27/08
- CPC B32B27/10
- CPC B32B27/308
- CPC B32B27/32
- CPC B32B27/36
- CPC B65D75/26
- CPC B29C48/0018
- CPC B29C55/28
- CPC B29K2023/06
- CPC B29K2067/00
- CPC B29K2096/02
- CPC B29L2031/7129
- CPC B32B2255/10
- CPC B32B2255/20
- CPC B32B2307/308
- CPC B32B2307/31
- CPC B32B2307/7242
- CPC B32B2307/7376
- CPC B32B2307/748
- CPC B32B2439/46
- CPC C09J2467/001
- CPC H01L23/49822
- CPC H01L21/4857
- CPC H01L23/49866
- CPC H01L24/16
- CPC H01L24/32
- CPC H01L24/73
- CPC H01L2224/16225
- CPC H01L2224/32225
- CPC H01L2224/73204
- CPC H01M50/129
- CPC C09J7/25
- CPC C09J7/255
- CPC C09J7/30
- CPC C09J7/50
- CPC C09J123/26
- CPC C09J175/04
- CPC H01M50/119
- CPC H01M50/121
- CPC H01M50/178
- CPC C09J2203/33
- CPC C09J2423/10
- CPC C09J2467/006
- CPC C09J2475/00
- CPC C09J2477/006
- CPC C09J2483/00
- CPC B32B2255/26
- CPC B32B2307/402
- CPC B32B2307/516
- CPC B32B2307/518
- CPC B32B2307/704
- CPC B32B2439/00
- CPC G01S7/4863
- CPC G01S7/4808
- CPC G01S7/497
- CPC G01S17/894
- CPC B01L3/50853
- CPC G01N21/6428
- CPC B01L2200/026
- CPC B01L2200/0689
- CPC B01L2200/16
- CPC B01L2300/041
- CPC B01L2300/1805
- CPC G01N2021/6439
- CPC G01S7/4816
- CPC G01S7/4865
- CPC B65D31/02
- CPC B65D31/10
- CPC B32B2250/02
- CPC B32B2255/12
- CPC B32B2255/205
- CPC B32B2255/28
- CPC B32B2307/718
- CPC B32B2307/7244
- CPC B32B2307/7246
- CPC C12Q1/02
- CPC C12N5/0638
- CPC C12N5/069
- CPC C12N5/0693
- CPC G02B5/1842
- CPC B42D25/324
- CPC B42D25/328
- CPC G02B5/1847
- CPC G02F1/133769
- CPC G02F1/133512
- CPC G02F1/134309
- CPC G02F1/13439
- CPC G02F1/13712
- CPC H05K1/056
- CPC H01L23/142
- CPC H01L23/32
- CPC H05K3/4626
- CPC H05K1/162
- CPC H05K1/0306
- CPC H05K1/115
- CPC H05K2201/068
- CPC H05K2201/09536
- CPC H05K2201/0959
- CPC H05K2201/09827
- Patent Trends by Company in 2024