Pages that link to "Category:Nicholas Alexander Polomoff of Hopewell Junction NY US"

The following pages link to Category:Nicholas Alexander Polomoff of Hopewell Junction NY US:

Displaying 15 items.

• International business machines corporation (20250004208). PHOTONIC OPTICAL FIBER PACKAGING (← links)
• International business machines corporation (20250006590). DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE (← links)
• International business machines corporation (20250006629). DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR (← links)
• International business machines corporation (20250006658). Three Dimensional Crackstop Interweave Architectural Design Using Supervia. (← links)
• International business machines corporation (20250006663). DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING (← links)
• International business machines corporation (20250006664). THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL (← links)
• International business machines corporation (20250006681). UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS (← links)
• International business machines corporation (20250112121). ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS (← links)
• 18476816. ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS (International Business Machines Corporation) (← links)
• International business machines corporation (20250119305). HYBRID BOND PHYSICAL UNCLONABLE FUNCTION (PUF) SECURITY STRUCTURE (← links)
• 18482879. HYBRID BOND PHYSICAL UNCLONABLE FUNCTION (PUF) SECURITY STRUCTURE (INTERNATIONAL BUSINESS MACHINES CORPORATION) (← links)
• International business machines corporation (20250140609). NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION (← links)
• 18496966. NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION (INTERNATIONAL BUSINESS MACHINES CORPORATION) (← links)
• International business machines corporation (20250149465). CRACKSTOP BARRIER ARCHITECTURE FOR HYBRID BONDED SEMICONDUCTOR PACKAGES (← links)
• 18504142. CRACKSTOP BARRIER ARCHITECTURE FOR HYBRID BONDED SEMICONDUCTOR PACKAGES (INTERNATIONAL BUSINESS MACHINES CORPORATION) (← links)