Pages that link to "Category:Dingying Xu of Chandler AZ (US)"
The following pages link to Category:Dingying Xu of Chandler AZ (US):
Displaying 50 items.
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240112971). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (← links)
- 17957359. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract (← links)
- Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract (← links)
- Intel corporation (20240203806). GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA simplified abstract (← links)
- Intel corporation (20240203853). DRY FILM PHOTORESIST WET LAMINATION AND METHOD simplified abstract (← links)
- Intel corporation (20240213116). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES simplified abstract (← links)
- Intel corporation (20240213169). LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (← links)
- Intel corporation (20240213170). GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract (← links)
- Intel corporation (20240215269). GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (← links)
- 18069507. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES simplified abstract (Intel Corporation) (← links)
- 18086265. LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (Intel Corporation) (← links)
- 18086293. GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract (Intel Corporation) (← links)
- 18086232. GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240219654). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (← links)
- Intel corporation (20240219655). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (← links)
- Intel corporation (20240219656). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (← links)
- Intel corporation (20240219659). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (← links)
- Intel corporation (20240219660). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (← links)
- Intel corporation (20240222136). ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract (← links)
- Intel corporation (20240222210). GLASS SUBSTRATE FABRICATION USING HYBRID BONDING simplified abstract (← links)
- Intel corporation (20240222238). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY simplified abstract (← links)
- Intel corporation (20240222243). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING simplified abstract (← links)
- Intel corporation (20240222257). GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract (← links)
- Intel corporation (20240222259). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS simplified abstract (← links)
- Intel corporation (20240222283). METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES simplified abstract (← links)
- Intel corporation (20240222301). METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES simplified abstract (← links)
- Intel corporation (20240222304). METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES simplified abstract (← links)
- Intel corporation (20240222345). DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract (← links)
- Patent Applications Report for 5th Jul 2024 (← links)
- 18089892. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation) (← links)
- 18089916. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation) (← links)
- 18089963. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation) (← links)
- 18089871. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation) (← links)
- 18089934. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation) (← links)
- 18091188. ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract (Intel Corporation) (← links)
- 18091548. GLASS SUBSTRATE FABRICATION USING HYBRID BONDING simplified abstract (Intel Corporation) (← links)
- 18091543. APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY simplified abstract (Intel Corporation) (← links)
- 18091555. APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING simplified abstract (Intel Corporation) (← links)
- 18089801. GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract (Intel Corporation) (← links)
- 18147535. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS simplified abstract (Intel Corporation) (← links)
- 18147487. METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES simplified abstract (Intel Corporation) (← links)
- 18147497. METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES simplified abstract (Intel Corporation) (← links)
- 18148148. METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES simplified abstract (Intel Corporation) (← links)
- 18090707. DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240243087). METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract (← links)
- 18620569. METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240264530). LIGHT RESPONSIVE PHOTORESISTS AND METHODS simplified abstract (← links)
- Intel corporation (20240270929). CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CONTAINERS, AND METHODS simplified abstract (← links)