[[Category:H01L31/0352]]
[[Category:H01L31/09]]
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877 bytes (113 words) - 00:58, 13 December 2024
[[Category:G03F7/09]]
[[Category:H01L31/08]]
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1 KB (183 words) - 07:44, 19 December 2024
IPC Code(s): G01S7/4865, G01S7/481, G01S17/10, H01L23/00, H01L31/107
...Category:G01S7/481]][[Category:G01S17/10]][[Category:H01L23/00]][[Category:H01L31/107]][[Category:CPC_G01S7/4865]][[Category:meta platforms technologies, llc
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12 KB (1,816 words) - 05:20, 18 July 2024
* [[:Category:CPC_H01L31/02013|H01L31/02013]] (Details)
[[Category:CPC_C07C311/09]]
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15 KB (2,006 words) - 06:44, 19 July 2024
...:Category:C12N5/078|C12N5/078]] (1 applications), [[:Category:H01L31/02016|H01L31/02016]] (1 applications), [[:Category:H01S5/04254|H01S5/04254]] (1 applicat
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28 KB (3,504 words) - 04:04, 4 December 2023
* [[:Category:CPC_H01L31/1892|H01L31/1892]] (Processes or apparatus specially adapted for the manufacture or tre
* [[:Category:CPC_H01L31/0392|H01L31/0392]] (including thin films deposited on metallic or insulating substrates
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21 KB (2,799 words) - 09:31, 18 July 2024
* [[:Category:CPC_H01L31/1892|H01L31/1892]] (Processes or apparatus specially adapted for the manufacture or tre
* [[:Category:CPC_H01L31/0392|H01L31/0392]] (including thin films deposited on metallic or insulating substrates
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21 KB (2,799 words) - 09:05, 20 July 2024
...30/10]] (2), [[:Category:H02S20/25|H02S20/25]] (2), [[:Category:H01L31/049|H01L31/049]] (2), [[:Category:H02S40/36|H02S40/36]] (2), [[:Category:G06F17/16|G06
...egory:G06Q10/02|G06Q10/02]] (6 applications), [[:Category:B60W30/09|B60W30/09]] (6 applications)
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36 KB (4,442 words) - 02:33, 5 January 2024
...HIKI KAISHA has filed patents in the areas of [[:Category:B60W30/09|B60W30/09]] (6 applications), [[:Category:G06V20/56|G06V20/56]] (5 applications), [[:
...gory:G01N33/57484|G01N33/57484]] (1 applications), [[:Category:H01L31/0224|H01L31/0224]] (1 applications), [[:Category:G06T2207/10064|G06T2207/10064]] (1 app
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46 KB (5,621 words) - 06:41, 2 February 2024
IPC Code(s): G02B6/124, G02B1/11, H01L31/0216, H01L31/0232
...ategory:G02B6/124]][[Category:G02B1/11]][[Category:H01L31/0216]][[Category:H01L31/0232]][[Category:CPC_G02B6/124]][[Category:taiwan semiconductor manufacturi
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88 KB (13,089 words) - 03:53, 30 March 2025
[[:Category:C07C5/09|C07C5/09]] (2 applications), [[:Category:B01J31/18|B01J31/18]] (2 applications), [[:
...tegory:H01L31/0224|H01L31/0224]] (1 applications), [[:Category:H01L31/0725|H01L31/0725]] (1 applications)
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60 KB (7,598 words) - 05:42, 2 July 2024
...[[:Category:H01L31/05|H01L31/05]] (1 applications), [[:Category:H01L31/054|H01L31/054]] (1 applications)
[[:Category:C07F9/09|C07F9/09]] (1 applications), [[:Category:A61K9/127|A61K9/127]] (1 applications), [[:
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72 KB (8,936 words) - 08:59, 19 February 2025
[[:Category:CPC_B60W30/08|B60W30/08]] (1), [[:Category:CPC_B60W30/09|B60W30/09]] (1), [[:Category:CPC_B60W60/0011|B60W60/0011]] (1), [[:Category:CPC_B60W6
...egory:B60W60/00|B60W60/00]] (5 applications), [[:Category:B60W30/09|B60W30/09]] (4 applications), [[:Category:G01R31/3835|G01R31/3835]] (4 applications)
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89 KB (11,260 words) - 17:33, 9 March 2025
...egory:B60W10/08|B60W10/08]] (4 applications), [[:Category:B60W30/09|B60W30/09]] (4 applications), [[:Category:B60L58/13|B60L58/13]] (4 applications), [[:
[[:Category:F03D7/06|F03D7/06]] (2 applications), [[:Category:H01L31/0725|H01L31/0725]] (2 applications), [[:Category:G01R33/36|G01R33/36]] (2 applications)
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39 KB (4,888 words) - 04:21, 2 January 2024
...ode(s): G02B6/42, G02B6/12, G02B6/122, H01L21/324, H01L27/06, H01L31/0232, H01L31/18
...egory:H01L21/324]][[Category:H01L27/06]][[Category:H01L31/0232]][[Category:H01L31/18]][[Category:CPC_G02B6/42]][[Category:micron technology, inc.]]
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54 KB (8,421 words) - 01:00, 13 December 2024
IPC Code(s): G03G5/10, C08K3/22, C08K3/36, C08K5/09, C08K5/19, C08K5/3445, C08K5/41, C08K5/42, C08K5/50, C08K5/52, C08K5/5313,
...egory:G03G5/10]][[Category:C08K3/22]][[Category:C08K3/36]][[Category:C08K5/09]][[Category:C08K5/19]][[Category:C08K5/3445]][[Category:C08K5/41]][[Categor
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80 KB (12,444 words) - 04:18, 14 June 2024
IPC Code(s): G01J5/20, G01J5/08, H01L31/0352, H01L31/09
...y:G01J5/20]][[Category:G01J5/08]][[Category:H01L31/0352]][[Category:H01L31/09]][[Category:CPC_G01J5/20]][[Category:nec corporation]]
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55 KB (8,264 words) - 00:58, 13 December 2024
* [[:Category:CPC_H01L31/1136|H01L31/1136]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
[[Category:CPC_G06N3/09]]
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18 KB (2,475 words) - 17:39, 18 July 2024
* [[:Category:CPC_H01L31/1136|H01L31/1136]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
[[Category:CPC_G06N3/09]]
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19 KB (2,563 words) - 07:02, 25 July 2024
IPC Code(s): G03F7/039, G03F7/09, G03F7/11, G03F7/20, G03F7/38, H01L21/027
...t layer to be developed and removed.[[Category:G03F7/039]][[Category:G03F7/09]][[Category:G03F7/11]][[Category:G03F7/20]][[Category:G03F7/38]][[Category:
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118 KB (17,427 words) - 16:40, 14 March 2025
