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20250166978. Plasma Abatement Techn (Applied Materials, .)
'''CPC Classification''': [[:Category:CPC_H01J37/32844|H01J37/32844]] (Gas-filled discharge tubes (heating by discharge )) [[Category:CPC_H01J37/32844]] ...

2 KB (260 words) - 12:00, 25 May 2025
20250232966. Wafer Processing (Hitachi High-Tech)
'''CPC Classification''': [[:Category:CPC_H01J37/32844|H01J37/32844]] (Gas-filled discharge tubes (heating by discharge )) [[Category:CPC_H01J37/32844]] ...

2 KB (309 words) - 03:14, 21 July 2025
Samsung electronics co., ltd. (20250149314). SCRUBBER, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
.../32"},{"@type":"PropertyValue","name":"CPC Classification","value":"H01J37/32844"}]}} [[Category:H01J37/32]] ...

5 KB (727 words) - 17:15, 8 May 2025
18931884. SCRUBBER, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME (Samsung Electronics Co., Ltd.)
.../32"},{"@type":"PropertyValue","name":"CPC Classification","value":"H01J37/32844"}]}} [[Category:H01J37/32]] ...

5 KB (727 words) - 07:24, 9 May 2025
Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
CPC Code(s): A44B11/26 CPC Code(s): A61B5/1116 ...

360 KB (55,870 words) - 05:03, 9 May 2025