SOLID-STATE IMAGING ELEMENT

Organization Name

sony semiconductor solutions corporation

Inventor(s)

Ryoto Yoshita of Kanagawa (JP)

Takashi Machida of Kanagawa (JP)

Luonghung Asakura of Kanagawa (JP)

Yoshiaki Inada of Kanagawa (JP)

Yoshimichi Kumagai of Kanagawa (JP)

Toru Shirakata of Kanagawa (JP)

SOLID-STATE IMAGING ELEMENT

This abstract first appeared for US patent application 20240414450 titled 'SOLID-STATE IMAGING ELEMENT

Original Abstract Submitted

in a solid-state imaging element that performs exposure in all pixels at the same time, image quality is improved. a solid-state imaging element includes a previous-stage circuit, a plurality of capacitive elements, a selection circuit, and a subsequent-stage circuit. in the solid-state imaging element, the previous-stage circuit converts charges into a voltage using each of a plurality of conversion efficiencies and outputs it to the previous-stage node. one ends of the plurality of capacitive elements are connected to the previous-stage node in common. the selection circuit connects the other end of one of the plurality of capacitive elements to a subsequent-stage node. the subsequent-stage circuit reads the voltage via the subsequent-stage node.