SEMICONDUCTOR APPARATUS

Organization Name

sony semiconductor solutions corporation

Inventor(s)

SEMICONDUCTOR APPARATUS

This abstract first appeared for US patent application 20240413187 titled 'SEMICONDUCTOR APPARATUS

Original Abstract Submitted

to improve characteristics in a semiconductor apparatus manufactured from a wafer shared in a plurality of manufacturing processes. a semiconductor apparatus includes an opening for a pad, a wiring layer, and a dummy pattern. in the semiconductor apparatus, the opening for a pad is formed on a front surface of a substrate. in addition, in the semiconductor apparatus, a predetermined electrode pad is provided in the opening for a pad. in the semiconductor apparatus, a front surface-side wiring layer is formed in the substrate. in the semiconductor apparatus, a dummy pattern is formed around a dummy non-forming region penetrating up to the front surface-side wiring layer from a rear surface relative to the front surface.