Snap inc. (20250123502). JOINT MOUNTING MECHANISM FOR ELECTRONIC DEVICE HOUSING ASSEMBLY
JOINT MOUNTING MECHANISM FOR ELECTRONIC DEVICE HOUSING ASSEMBLY
Organization Name
Inventor(s)
Emily Lauren Clopp of Santa Monica CA US
Douglas Wayne Moskowitz of Marina Del Rey CA US
Stephen Andrew Steger of Los Angeles CA US
Nicholas Daniel Streets of Santa Monica CA US
JOINT MOUNTING MECHANISM FOR ELECTRONIC DEVICE HOUSING ASSEMBLY
This abstract first appeared for US patent application 20250123502 titled 'JOINT MOUNTING MECHANISM FOR ELECTRONIC DEVICE HOUSING ASSEMBLY
Original Abstract Submitted
a housing assembly for an electronics-enabled device includes a housing wall having parallel inner and outer faces, with a hinge base affixed through the wall. the hinge base has a shank extending through the wall and a joint mount exterior to the housing for hingedly mounting an external component. an anchor plate inside the housing is welded to the shank, preventing axial withdrawal of the hinge base by obstruction against the inner face. the welded connection rotationally keys the anchor plate to the hinge base. the assembly enables integration of electronics components mounted on the anchor plate, which can serve as a thermal conductor between heat-generating components and an external heatsink via the hinge base. in electronics-enabled eyewear, the hinge base provides hinged connection of a temple to an eyewear frame. manufacturing involves locating the hinge base and anchor plate, translationally fastening them together threadedly, and spot-welding for rotational keying.