Sk hynix inc. (20240264911). DEVICES USING CHIPLET BASED STORAGE ARCHITECTURES simplified abstract
DEVICES USING CHIPLET BASED STORAGE ARCHITECTURES
Organization Name
Inventor(s)
Dong Sop Lee of Icheon-si (KR)
DEVICES USING CHIPLET BASED STORAGE ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240264911 titled 'DEVICES USING CHIPLET BASED STORAGE ARCHITECTURES
The abstract of a patent application describes a device for implementing a storage architecture, consisting of a front-end chip, a plurality of back-end chips, and a memory chip.
- The front-end chip interfaces with a first device, while the back-end chips interface with second devices.
- The memory chip communicates with the front-end chip and is separate from the other chips in the device.
Potential Applications:
- Data storage systems
- Networking devices
- Cloud computing infrastructure
Problems Solved:
- Efficient data storage and retrieval
- Seamless communication between different devices
- Scalability in storage architecture
Benefits:
- Improved data management
- Enhanced system performance
- Simplified integration of storage components
Commercial Applications:
- Data centers
- Enterprise storage solutions
- Networking equipment manufacturers
Prior Art: Prior art related to this technology may include patents or research papers on storage architectures, memory chips, and data communication protocols.
Frequently Updated Research: Stay informed about advancements in storage technologies, memory chip development, and data storage solutions to enhance the performance of storage architectures.
Questions about the technology: 1. How does the separation of the memory chip from the front-end and back-end chips benefit the storage architecture? 2. What are the key differences between the front-end and back-end chips in terms of their interfacing capabilities?
Original Abstract Submitted
a device for implementing a storage architecture includes a front-end chip configured to perform first interfacing with a first device, a plurality of back-end chips configured to perform second interfacing with second devices, and a memory chip disposed to be separated from the front-end chip and the plurality of back-end chips and configured to perform a communication with the front-end chip.