Seiko epson corporation (20250109014). Method For Manufacturing Vibration Device
Method For Manufacturing Vibration Device
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Method For Manufacturing Vibration Device
This abstract first appeared for US patent application 20250109014 titled 'Method For Manufacturing Vibration Device
Original Abstract Submitted
a method for manufacturing a vibration device includes: preparing a base including a semiconductor substrate having a first surface, on which a circuit element is formed, and a second surface, and a first insulating layer disposed on the first surface of the semiconductor substrate and covering the circuit element; forming a second insulating layer by depositing an insulator on a fifth surface of the first insulating layer on a side opposite to the semiconductor substrate; planarizing at least a part of a third surface of the second insulating layer on a side opposite to the base by polishing; forming a mount electrode on the polished third surface of the second insulating layer; and bonding a vibration element to the mount electrode.