Seiko epson corporation (20250108565). THREE-DIMENSIONAL MOLDING SYSTEM
THREE-DIMENSIONAL MOLDING SYSTEM
Organization Name
Inventor(s)
Shigeru Yamazaki of SHIOJIRI-SHI JP
THREE-DIMENSIONAL MOLDING SYSTEM
This abstract first appeared for US patent application 20250108565 titled 'THREE-DIMENSIONAL MOLDING SYSTEM
Original Abstract Submitted
a three-dimensional molding system includes a molding unit including a heater for plasticizing a material to generate a molding material and a nozzle for discharging the molding material, a stage, a position changing unit configured to change relative positions of the stage and the nozzle, an imaging unit disposed further on an outer side than an outer edge of the molding surface when viewed from a direction perpendicular to the molding surface, a housing including an inner wall that defines an internal space and an outer wall, and a control unit configured to control the molding unit and the position changing unit based on molding data. at least a part of the inner wall is made of a first transparent member, and the imaging unit is disposed between the inner wall and the outer wall.